Stale Pre-tender

Sub-Micron Die Bonder

Details

Buyer: University of Sheffield
Value: £380,000
Topic: Laboratory, optical and precision equipments (excl. glasses)
Published: 9 December 2025
Submission: 26 November 2025
Source: uk:find_a_tender

Tender description

We are seeking equipment that can provide a wide range of bonding technologies to cater for semiconductor die to wafer, die to chip, wafer to wafer, fli-chip and other semiconductor chiplet bonding, to support our work in Heterogeneous Integration for Microelectronics and Semiconductor Systems.

Timeline

Completed: Pre-tender published9 December 2025
Current notice

About the buyer

University of Sheffield is a higher education institution whose Procurement Office lets and manages contracts for its schools and departments. The university also buys through regional and national frameworks as a member of the North Eastern Universities Purchasing Consortium, part of UKUPC. They cover catering, furniture, computing, laboratory supplies, postal services, domestic services, professional services and stationery. Once a contract is let, each school and department must buy from the contracted supplier.

Over the past 5 years, most of University of Sheffield's contract awards have been in construction work, industrial machinery and laboratory and precision equipment.

Decision makers

Connect with the people behind this procurement.

Job title	Phone number	Work email
Head of Procurement	+44 •••• ••••••	••••••••@university-of-sheffield.gov
Commercial Director	+44 •••• ••••••	••••••••@university-of-sheffield.gov
Procurement Manager	+44 •••• ••••••	••••••••@university-of-sheffield.gov
Category Lead	+44 •••• ••••••	••••••••@university-of-sheffield.gov
Senior Buyer	+44 •••• ••••••	••••••••@university-of-sheffield.gov
Contracts Manager	+44 •••• ••••••	••••••••@university-of-sheffield.gov