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University of Strathclyde tenders and contracts

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University of Strathclyde tenders & contracts

  • Open

    Published 11 days ago

    Supply, Delivery and Installation of High Accuracy Motion Control and Imaging System

    time-iconClose date: 07/09/2026

    Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly a...

  • Open

    Published 11 days ago

    Supply and Delivery of FPGA Based Configurable Multi-Instrument Source and Detector

    time-iconClose date: 25/08/2026

    Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly...

  • Open

    Published 12 days ago

    Supply, Delivery and Installation of Leak Testing Kit

    time-iconClose date: 18/08/2026

    Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly...

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  • Open

    Published 13 days ago

    Supply, Delivery and Installation of Automated Laser Chip Burn-in Tester

    time-iconClose date: 07/09/2026

    Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly...

  • Open

    Published 13 days ago

    Supply, Delivery and Installation of Optical Alignment & Packaging System

    time-iconClose date: 04/09/2026

    Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly a...

  • Open

    Published 13 days ago

    Supply, Delivery and Installation of Laser Waveguide Writing Equipment

    time-iconClose date: 04/09/2026

    Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly a...

  • Open

    Published 13 days ago

    Supply, Delivery, Installation and Commissioning of Submicron Flip-Chip Die Bonder

    time-iconClose date: 04/09/2026

    Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly...

  • Open

    Published 13 days ago

    Supply, Delivery and Installation of Laser Waveguide Writing Equipment

    time-iconClose date: 04/09/2026

    Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly...

  • Open

    Published 13 days ago

    Supply, Delivery and Installation of Automated Laser Chip Burn-in Tester

    time-iconClose date: 07/09/2026

    Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly a...

  • Open

    Published 13 days ago

    Supply, Delivery, Installation and Commissioning of Submicron Flip-Chip Die Bonder

    time-iconClose date: 04/09/2026

    Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly a...

  • Open

    Published 13 days ago

    Supply, Delivery and Installation of Optical Alignment & Packaging System

    time-iconClose date: 04/09/2026

    Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly...

  • Open

    Published 16 days ago

    Supply, Delivery, Installation & Commissioning of a Die Inspection Sorter

    price-tag-icon1,160,000 GBPtime-iconClose date: 01/09/2026

    Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly a...

Decision makers at University of Strathclyde

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Top suppliers to University of Strathclyde

Explore relationships between University of Strathclyde and suppliers to understand where partner opportunities exist, and competitor incumbents prevail.

Supplier nameSME?Number of awardsView awards
Taylor and Fraser Ltd (SC155035)Yes25View awards
Clark Contracts (SC088490)Yes24View awards
COMPUTACENTER (UK) LIMITEDUnknown22View awards
HP Inc UK LtdNo14View awards
Bruker UK LimitedNo13View awards

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