Scanning electron microscopes

Description

DTU Nanolab will procure a Small Dual Beam (SDB) for sample analysis and preparation of samples in the range 5nm thickness to >1mm3. The tool will be able to carry out fully automated Electron and Ion Beam alignments, TEM Lamella preparation including pick and place onto TEM grids, Automated 3D Slice and View, Capable of scripting using Python and able to be controlled for Ma-chine Learning. Electron optics must achieve 0.6nm nominal resolution 2-15keV with a monochromated energy spread >200meV. Liquid metal (Ga) Ion source is not acceptable for this application. The FIB should be multi species focused gas plasma. In-column Energy filtering detectors are necessary for the successful imaging of the wide array of sample types analyzed/prepared at DTU Nanolab Remote operation is essential for everyday users and service. The Helios 5 Hydra PFIB DualBeam introduces the only PFIB-SEM microscope with Xe PFIB. The SEM with Flash image optimization feature adjusts focus, stigmation and lens align in 20 sec. to ease obtaining high resolution images. The Helios Hydra PFIB is ideal choice for Ga-free sample preparation and 3D characterization techniques like FIB tomography or elemental characterization. It switches between xenon, argon, oxygen or nitrogen. The fully integrated manipulator for in-situ lift-out of lamellae for S/TEM, the EasyLift EX, is capable of rotation which uniquely makes it easy to thin samples from the back side as mounting in 90 or 180 degree orientations is possible. Electron Optics Schottky FEG provides an electron beam with incident energy ranging from 20 eV - 30 000 eV and current range of 0.6 pA to 100 nA. Monochromated electron beam energy spread <200 meV across all accelerating voltages up 100 pA of beam current across incident beam range of 500 eV – 5 keV and landing energies <20 eV Immersion lens imaging mode enables imaging over a working distance from 8mm to 0.5mm. The combination of these electron optical elements allows the system to achieve Extreme High Resolution (XHR), specified as: Electron beam resolution @ optimum WD: • 0.6 nm at 15 keV, • 0.6 nm at 2 keV, • 0.7 nm at 1 keV, • 1.0 nm at 500 eV, • 1.1 nm at 350 eV. Analytical Resolution • < 2.0 nm at 15 keV (6.4 nA). Ion Optics ICP mulit-source provides a focused ion beam with incident energies ranging from 500 V-30 kV over a beam current range of 1.5 pA to 2.5 uA. The multi-source allows for fast switching be-tween xenon, argon, oxygen and nitrogen. The lowest energy ion beam (0.5 kV) to provide a sufficient view of a TEM lamella at the final pol-ishing stage of an in-situ lift-out sample preparation. A two-stage differentially pumped ion column to ensure the high-fidelity transfer of a pattern under all vacuum conditions. The combination of these ion-optical elements allows the Helios Hydra PFIB DualBeam to meet or exceed the following performance specifications: Ion beam resolution • 20 nm at 30 kV (preferred statistical method), • 10 nm @ 30 kV (selective edge method). Signal detectors Optical navigation camera- full view of sample holder over the full range of travel of the XY stage. Low voltage, high contrast directional back scatter detector. Single Crystal retractable STEM detector with annular BF and DF regions and a segmented annular HAADF region. Secondary electron (SE) and secondary ion (SI) detector (ICE™). In-Column Detector (ICD) Fully integrated plasma cleaner for sample and chamber cleaning. Automation AutoTEM 5 sample preparation software designed for unattended sample preparation of S/TEM specimens. Furthermore, the automation platform offers guided assist to novice users in the use of the EasyLift manipulator for extracting samples and placing them onto TEM grids. AutoTEM 5 Automation Science is an extension for AutoTEM 5 Fully automated in-situ lift-out step for inverted, top down and planar use cases. This enables the following workflows: — top down: unattended, fully automated, multi-site sample preparation, covering all steps - chunk-ing, lift-out and final thinning; — planar/inverted: unattended, fully automated, multi-site chunking and lift-out (maximum 3 sites per run). Final thinning is semi-automated for Planar and manual for Inverted use case. Auto slice and view 4 automated FIB tomography package. Serially acquire signals from the system or 3rd party detectors automated/unattended. Simultaneous signal acquisition, multiple fields of view. Pause project and make changes on the fly without stopping the project. AutoScript 4 Application Programming Interface (API) based on the high-level programming lan-guage Python.