Awarded contract

Published 4 years ago

Beschaffung eines Wafer-Bonding-Systems

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Buyer

Technische Universität Berlin – Der Präsident

Value

279,996 EUR

Current supplier

SUSS Micro Tec Lithography GmbH

Description

Die Technische Universität Berlin plant, ein System zum Waferbonden zu beschaffen. Die Ausschreibung umfasst die Hardware, die Installation sowie die Schulung am Gerät. Lot 1: Die Technische Universität Berlin plant, ein System zum Waferbonden zu beschaffen. Die Ausschreibung umfasst die Hardware, die Installation sowie die Schulung am Gerät.

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Product / service

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Contract structure

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Organisation mentioned

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Supplier requirements

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CPV Codes

31712100 - Microelectronic machinery and apparatus

31712000 - Microelectronic machinery and apparatus and microsystems

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31712200 - Microsystems

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