Awarded contract

Published

Film Assisted Molding Anlage

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Value

330,000 EUR

Current supplier

Boschmann advanced packaging technology

Description

Film Assisted Molding (FAM) Anlage u.a. zur Verarbeitung von EMCs Lot 1: Lieferung Film Assisted Molding (FAM) Anlage u.a. zur Verarbeitung von EMCs gemäß Spezifikation

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