Wafer Level Electroplating Tool

Description

The University of Southampton is looking to purchase a production capable wafer level electroplating tool for use in state-of-the-art wafer scale fabrication research. The tool is intended to perform back-end-of-line wafer fabrication processes and research including the fabrication of near device interconnects, through-silicon vias and wafer scale advanced packaging including development of interposers and re-distribution layers on various substrates. The electroplating tool will be installed within a dedicated processing area in the fabrication cleanrooms and is expected to replace the existing manual electroplating system.