DUV Stepper

Description

To ensure the continuation of small and medium sized companies chip production and development in Danmark DTU Nanolab want to purchase a new (non-refurbished) DUV stepper using a 248 nm wavelength laser as illumination source (KrF laser unit from CYMER). It must furthermore be possible to handle several different wafer types and sizes: Wafer materials: Silicon, LNOI, Borofloat, quartz, III-V Wafer sizes in diameter: 100mm, 150mm and 200mm, furthermore it must be equipped with a multi wafer handling kit such that easy switching between at least 150mm and 200mm wafers is possible without longer downtime for reconfiguration of the equipment. Wafer thickness to be handled are from 350µm up to 1000µm and they can come with a bow up to at least +/- 200um for some wafers. As well as wafers with either notch or primary and secondary flats. It should also be equipped with a through silicon alignment possibility. The equipment must further have the possibility of off-axis as well as dipole illumination. Reuse of existing reticles and easy transfer of existing job files from the DUV stepper FPA-3000EX4 are essential. Due to space restriction the footprint of the main body must not exceed 2000mm x 3000mm x 2700mm (W x D x H).