Camera bodies

Description

DESY is one of the world's leading accelerator centres. Researchers use the large-scale facilities at DESY to explore the microcosm in all its variety. Zeuthen is (besides Hamburg) the second location of DESY, located in the south-eastern outskirts of Berlin. Since 2011, the DESY Zeuthen campus has been profiled as a globally visible center for astroparticle physics. DESY Zeuthen is involved in several international research projects in astroparticle physics. Ultrasat is an astronomical satellite mission whose wide-angle telescope will perform a deep time-resolved all-sky survey in the near-ultraviolet (NUV). The satellite shall be in orbit in 2024 and will then take data for at least three years. The main science objectives of Ultrasat are the detection of counterparts to gravitational wave sources and of supernovae. DESY joined the ULTRASAT mission in 2019 and will provide the Focal Plane Array (FPA or ‘camera’). The core of the camera will be a back side-illuminated (BSI) CMOS sensor array, consisting of 4 sensors. These sensors will be assembled on a package. The sensor package shall be designed, produced and assembled by an external company and is subject of this tender. A 3D model of the package and parts of the camera's mechanical structure is shown in the Technical Note (figure 1). Please note, that this is a preliminary model, the design of the package needs to be done by the supplier in interaction with DESY. The shown package entails substrates carrying the sensors (sensor carriers) and a harness with cables. The sensors will be assembled (glued and bonded) on the sensor carriers. The sensor carriers will be mounted on a mounting plate. The mechanical and electrical interfaces to the camera will be defined within this process. The CMOS sensors will be delivered by DESY approximately April 2021. They need to be assembled (i.e. glued and bonded) onto the package. DESY expects that several iterations with mechanical test sensors provided by DESY will be needed to determine the best assembly procedures. The requirements for the package are listed in the Technical Note. Production and assembly of the package shall be performed following space standards and stringent cleanliness requirements needs to be followed, as will be detailed in the Technical Note. For further Information see Technical Note.