4939.SH.JN - Wafer Lapper and Polisher Tool

Description

The EPSRC National Epitaxy Facility at The University of Sheffield with funding from EPSRC is looking to procure a high-precision automated lapper/polisher machine for the purpose of thinning semiconductor substrates to accurately controlled thicknesses with high uniformity and flatness.<br /><br />This is an open exercise. The ITT can be downloaded by registering and expressing your interest on the University`s e-tendering system https://in-tendhost.co.uk/sheffield<br /><br />If you have any questions or comments in relation to this tender they must be submitted via the In-tend system, this can be accessed at https://in-tendhost.co.uk/sheffield<br /><br />Completed tenders must be returned through the same e-tendering system.<br /><br />The closing date of receipt of tenders: 19th January 2026 at 12 noon (UK time).