4940.SH.JN - Wafer Scribe and Break Tool

Description

The EPSRC National Epitaxy Facility at The University of Sheffield with funding from EPSRC is looking to procure a scribe and break machine for the purpose of preparation of precisely cleaved smaller semiconductor substrates for epitaxy. It will also be used to accurately cleave mirror-like facets (e.g. for lasers and cross-sections for SEM analysis).<br /><br />This is an open exercise. The ITT can be downloaded by registering and expressing your interest on the University`s e-tendering system https://in-tendhost.co.uk/sheffield<br /><br />If you have any questions or comments in relation to this tender they must be submitted via the In-tend system, this can be accessed at https://in-tendhost.co.uk/sheffield<br /><br />Completed tenders must be returned through the same e-tendering system.<br /><br />The closing date of receipt of tenders: 19th January 2026 at 12 noon (UK time).