Awarded contract
Published
Research laboratory services
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Description
Single-sided processing of 150 mm silicon wafers (24 pcs) using SINTEF's in-house ‘Deep Reactive Ion Etch (DRIE)’ fabrication technology. Total budget: NOK 2.5 million (base) + NOK 7.5 million (options). Time frame: starting 2020Q3, 48 weeks (base). Options up to three subsequent runs of 24 wafers each, 48 weeks production time. Single-sided processing of 150 mm silicon wafers (24 pcs) using SINTEF's in-house ‘Deep Reactive Ion Etch (DRIE)’ fabrication technology. Total budget: NOK 2.5 million (base) + NOK 7.5 million (options). Time frame: starting 2020Q3, 48 weeks (base). Options up to three subsequent runs of 24 wafers each, 48 weeks production time.
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