Provision of a Solder Ink-Jet Dispenser

Description

The equipment’s function is to deposit solder spheres on to metallised substrates to enable attachment of photonic and electronic devices using a thermal reflow process. The solder sphere diameters should be in the range of 50 to 100 microns, with capabilities to reduce to smaller diameter solder spheres in the future. The system should be capable of depositing these solder spheres in a rapid sequence on individual or diced chips and full wafers with a minimum diameter of 200 mm. Furthermore, the system should be capable of jetting a variety of solder sphere materials (eutectics) to enable different thermal reflow processes.