UKRI-3441 Ball Bonder for Studding and Wire Bonding of Microelectronic Components

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Buyer

UK Research & Innovation

Value

250,000 GBP

Current supplier

Inseto

Description

UK Research and Innovation's (UKRI) Science and Technology Facilities Council (STFC) had a requirement for the provision of a Ball Bonder for Studding and Wire Bonding of Microelectronic.

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Product / service

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Contract structure

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Organisation mentioned

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Supplier requirements

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Chairman

Redacted

redacted@redacted.co.uk

+44 01234 567 890

Chief Executive

Chief Officer

Redacted

redacted@redacted.co.uk

+44 01234 567 890

Chief Information Officer

Top Level Director

University of Sheffield

638,000 GBP

Published 2 years ago

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CPV Codes

31712000 - Microelectronic machinery and apparatus and microsystems

31712300 - Printed circuits

31712200 - Microsystems

31712100 - Microelectronic machinery and apparatus

31710000 - Electronic equipment

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