Awarded contract

Published

UKRI-3441 Ball Bonder for Studding and Wire Bonding of Microelectronic Components

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Value

250,000 GBP

Current supplier

Inseto

Description

UK Research and Innovation's (UKRI) Science and Technology Facilities Council (STFC) had a requirement for the provision of a Ball Bonder for Studding and Wire Bonding of Microelectronic. Lot 1: UK Research and Innovation's (UKRI) Science and Technology Facilities Council (STFC) had a requirement for the provision of a Ball Bonder for Studding and Wire Bonding of Microelectronic.

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