Published
4947.SH.DM - Digital Microscope
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Description
This equipment will support research and development work in Heterogeneous Integration (HI) of MicroElectronic and Semiconductor Systems. We are interested in a wide range of bonding technologies to cater for semiconductor die to wafer, die to chip, wafer to wafer, flip-chip and other semiconductor chiplet bonding. This equipment will therefore be used to inspect the quality of bonding as well as inspection of failed systems. <br /><br />The closing date for returns to this tender is on 28th January 2026 at 13:00h (UK time)
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