Published 3 months ago

Sub-Micron Die Bonder

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Buyer

University of Sheffield

Value

380,000 GBP

Close date

2025-11-26

Description

We are seeking equipment that can provide a wide range of bonding technologies to cater for semiconductor die to wafer, die to chip, wafer to wafer, fli-chip and other semiconductor chiplet bonding, to support our work in Heterogeneous Integration for Microelectronics and Semiconductor Systems.

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Product / service

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Contract structure

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Organisation mentioned

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Supplier requirements

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President & Vice-Chancellor

Chief Officer

Redacted

redacted@redacted.co.uk

+44 01234 567 890

Chief Financial Officer

Deputy/Assistant Chief Officer

Redacted

redacted@redacted.co.uk

+44 01234 567 890

Interim Vice-President & Head of Faculty-Health

Deputy/Assistant Chief Officer

Redacted

redacted@redacted.co.uk

+44 01234 567 890

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