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Awarded

Wafer Dicing Saw

Published

Supplier(s)

Disco-Hitec Europe

Value

67,000 GBP

Description

Tenders should demonstrate that the supplier possesses a comprehensive process library and clearly show the ability to cut glass, quartz, sapphire, silicon and SiC substrates. Tenders should address how a 1 mm thick, 150 mm square glass substrates can be diced.

Timeline

Award date

a year ago

Publish date

a year ago

Buyer information

University of St Andrews

Email:
procurement@st-andrews.ac.uk

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